JTX JP-1 Preheating Platform Phone CPU Layering Glue Removal Model:JTX JP-1 Preheater

Name: JTX JP-1 Preheating Platform Phone CPU Layering Glue Removal Model:JTX JP-1 Preheater
Brand: adafip.org
SKU: 75723900976
Price: 14.95 USD
Availability: InStock
Rating: 4.5076 (22 reviews)

adafip.org

$ 14.95

Tax included. Shipping calculated at checkout.

Description

JTX JP-1 Preheating Platform Phone CPU Layering Glue Removal Model:JTX JP-1 PreheaterJTX JP 1 300W Universal Phone Motherboard Preheating Platform mobile phone iPhone CPU layering, lamination, reballing tinning, and glue removal repair. JTX JP 1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly. Features: 1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and

*HYUNDAI USA

is linked to the USB port of a computer)

EM78P458A(20P)

STM32F215RE

2L CDI (EDC16CP31-6) Sprinter (909) 2

Working environment: 3℃-45℃

can generate large-area ion flow

2592X1944(5

the exquisite and compact body showcases the portability of technology on the go

100% success rate per physical testing

The host has a built-in environment temperature sensor to avoid high-temperature operation

timed work function

Easy Shipping

Quick Dispatch:

Your JTX JP-1 Preheating Platform Phone CPU Layering Glue Removal Model:JTX JP-1 Preheater orders ship within 1-2 business days.

Delivery Options:

Standard: 3-7 business days
Fast: 2-3 business days
Express: 1-2 business days

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You'll receive a tracking link by email once your JTX JP-1 Preheating Platform Phone CPU Layering Glue Removal Model:JTX JP-1 Preheater ships.

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