8" Diamond Wafering Blade with Stainless Steel Core (Low Conc.), WB-008LCS Blade Attributes:Low Conc. Diamond

Vendor adafip.org
Regular price $ 389.76
Tax included. Shipping calculated at checkout.
Description

8" Diamond Wafering Blade with Stainless Steel Core (Low Conc.), WB-008LCS Blade Attributes:Low Conc. Diamond8 inch stainless steel low concentration diamond Wafering Blade

10-inch 120 grit SiC Abrasive Grinding Paper (Plain Backed) (100/box)

Conductive Premium Compression Mounting Resin (graphite powder)

10-inch 125 micron Diamond Abrasive Grinding Disk with magnetic stainless steel backing

available in (1 lb powder/ 12 oz liquid) or (5 lb powder/ 64 oz liquid)

8-inch 320 grit Premium SiC Abrasive Grinding Paper (Plain Backed) (50/box)

SiC Abrasive Belts 4-inch x 36-inch - 10/box - 80 grit-inch

12-inch 45 micron Diamond Abrasive Grinding Disk with PSA (adhesive backed) backing (each)

12-inch 800 grit Premium SiC Abrasive Grinding Paper (Plain Backed) (50/box)

8-inch Combination PSA (adhesive backed)-backed SiC papers (240

12-inch 220 grit Alumina Grinding Papers PSA (adhesive backed) (100/pkg)

8-inch 1200 grit Alumina Grinding Papers PSA (adhesive backed) (100/pkg)

05 micron DIAMAT Polycrystalline Water-Based Diamond Abrasive Suspension

Easy Shipping

Quick Dispatch:

Your 8" Diamond Wafering Blade with Stainless Steel Core (Low Conc.), WB-008LCS Blade Attributes:Low Conc. Diamond orders ship within 1-2 business days.

Delivery Options:

  • Standard: 3-7 business days
  • Fast: 2-3 business days
  • Express: 1-2 business days

Order Tracking:

You'll receive a tracking link by email once your 8" Diamond Wafering Blade with Stainless Steel Core (Low Conc.), WB-008LCS Blade Attributes:Low Conc. Diamond ships.

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